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Document ID Number: 328209 003EN Intel

Xeon Phi™ Coprocessor Datasheet

3.4.2 Thermal Profile and Cooling

The simplest cooling mechanism would involve running fans at full speed. For those

custom air-cooled solutions that intend to be economical in fan power usage and

acoustics, Figure 3-16 represents three regions on the SE10X/7120X coprocessor

power consumption curve relevant to system fan control.

Region (A-B) on the line represents the minimum necessary performance of a cooling

solution to keep the coprocessor silicon temperature (T

junction

) below T

throttle

of 104°C

(Ta b le 3- 2), during high power dissipation. In this region, a cooling solution based on

airflow would ensure the fans are operating at 100% capacity. In region B-C, the

coprocessor power consumption is low enough that the cooling solution may be set to

maintain the junction temperature at a target temperature. Finally, in region C-D, the

coprocessor may need to be cooled to below the target temperature to maintain a

reasonable exhaust air temperature.

Figure Figure 3-17 shows the analogous thermal behavior of T

case

Figure 3-16 SE10X/7120X SKU Coprocessor Junction Temperature (T

junction)

vs Power

45.0

55.0

65.0

75.0

85.0

95.0

105.0

0 50 100 150 200

Temperature(

Intel®XeonPhi™Copro cessor SiPower(W )

junction

104°C

1 2 ... 28 29 30 31 32 33 34 35 36 37 38 ... 77 78

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